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    • FTIR Study of Copper Agglomeration during Atomic Layer Deposition of Copper 

      Dai, Min; Kwon, Jinhee; Chabal, Yves J.; Halls, Mathew D.; Gordon, Roy Gerald (Materials Research Society, 2009)
      The growth of of metallic copper by atomic layer deposition (ALD) using copper(I) di-sec-butylacetamidinate \(([Cu(^sBu-amd)]_2)\) and molecular hydrogen \((H_2)\) on \(SiO_2/Si\) surfaces has been studied. The mechanisms ...