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dc.contributor.authorLi, Han
dc.contributor.authorTsui, Ting T.
dc.contributor.authorVlassak, Joost
dc.date.accessioned2009-06-25T14:17:14Z
dc.date.issued2009
dc.identifier.citationLi, Han, Ting T. Tsui, and Joost J. Vlassak. Forthcoming. Water diffusion and fracture behavior in nano-porous low-k dielectric film stacks. Journal of Applied Physics 105.en
dc.identifier.issn0021-8979en
dc.identifier.urihttp://nrs.harvard.edu/urn-3:HUL.InstRepos:3121069
dc.description.abstractAmong various low-dielectric constant (‘low-k’) materials under development, organosilicate glasses (OSG) containing nanometer-size pores are leading candidates for use as intra-metal dielectrics in future microelectronics technologies. In this paper, we investigate the direct impact of water diffusion on the fracture behavior of film stacks that contain porous OSG coatings. We demonstrate that exposure of the film stacks to water causes significant degradation of the interfacial adhesion energy, but that it has negligible effect on the cohesive fracture energy of the nanoporous OSG layer. Isotope tracer diffusion experiments combined with dynamic secondary ion mass spectroscopy (SIMS) show that water diffuses predominantly along the interfaces, and not through the porous films. This unexpected result is attributed to the hydrophilic character of the interfaces.en
dc.description.sponsorshipEngineering and Applied Sciencesen
dc.language.isoen_USen
dc.publisherAmerican Institute of Physicsen
dc.relation.isversionofhttp://jap.aip.org/en
dash.licenseOAP
dc.subjectwater diffusionen
dc.subjectSIMSen
dc.subjectcrackingen
dc.subjectporousen
dc.subjectdielectricsen
dc.titleWater Diffusion and Fracture Behavior in Nano-Porous Low-K Dielectric Film Stacksen
dc.typeJournal Article
dc.description.versionAccepted Manuscript
dc.relation.journalJournal of Applied Physicsen
dash.depositing.authorVlassak, Joost
dash.contributor.affiliatedLi, Han
dash.contributor.affiliatedVlassak, Joost


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