Failure by Simultaneous Grain Growth, Strain Localization, and Interface Debonding in Metal Films on Polymer Substrates

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Failure by Simultaneous Grain Growth, Strain Localization, and Interface Debonding in Metal Films on Polymer Substrates

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dc.contributor.author Vlassak, Joost J.
dc.contributor.author Lu, Nanshu
dc.contributor.author Wang, Xi
dc.contributor.author Suo, Zhigang
dc.date.accessioned 2010-07-08T13:22:29Z
dc.date.issued 2009
dc.identifier.citation Lu, Nanshu, Xi Wang, Zhigang Suo, and Joost Vlassak. 2009. Failure by simultaneous grain growth, strain localization, and interface debonding in metal films on polymer substrates. Journal of Materials Research 24(2): 379-385. en_US
dc.identifier.issn 0884-2914 en_US
dc.identifier.uri http://nrs.harvard.edu/urn-3:HUL.InstRepos:4276342
dc.description.abstract In a previous paper, we have demonstrated that a microcrystalline copper film well bonded to a polymer substrate can be stretched beyond 50% without cracking. The film eventually fails through the co-evolution of necking and debonding from the substrate. Here we report much lower strains to failure (around 10%) for polymer-supported nanocrystalline metal films, whose microstructure is revealed to be unstable under mechanical loading. We find that strain localization and deformation-associated grain growth facilitate each other, resulting in an unstable deformation process. Film/substrate delamination can be found wherever strain localization occurs. We therefore propose that three concomitant mechanisms are responsible for the failure of a plastically deformable but microstructurally unstable thin metal film: strain localization at large grains, deformation-induced grain growth and film debonding from the substrate. en_US
dc.description.sponsorship Engineering and Applied Sciences en_US
dc.language.iso en_US en_US
dc.publisher Materials Research Society en_US
dc.relation.isversionof doi:10.1557/JMR.2009.0048 en_US
dc.relation.hasversion www.seas.harvard.edu/vlassak_group/publications/69_Failure2009.PDF en_US
dash.license OAP
dc.subject cu films en_US
dc.subject grain growth en_US
dc.subject strain localization en_US
dc.subject debonding en_US
dc.subject Kapton en_US
dc.title Failure by Simultaneous Grain Growth, Strain Localization, and Interface Debonding in Metal Films on Polymer Substrates en_US
dc.type Journal Article en_US
dc.description.version Accepted Manuscript en_US
dc.relation.journal Journal of Materials Research en_US
dash.depositing.author Vlassak, Joost J.
dc.date.available 2010-07-08T13:22:29Z

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  • FAS Scholarly Articles [6885]
    Peer reviewed scholarly articles from the Faculty of Arts and Sciences of Harvard University

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