Failure by Simultaneous Grain Growth, Strain Localization, and Interface Debonding in Metal Films on Polymer Substrates
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| dc.contributor.author |
Vlassak, Joost J.
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| dc.contributor.author |
Lu, Nanshu |
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| dc.contributor.author |
Wang, Xi |
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| dc.contributor.author |
Suo, Zhigang
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| dc.date.accessioned |
2010-07-08T13:22:29Z |
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| dc.date.issued |
2009 |
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| dc.identifier.citation |
Lu, Nanshu, Xi Wang, Zhigang Suo, and Joost Vlassak. 2009. Failure by simultaneous grain growth, strain localization, and interface debonding in metal films on polymer substrates. Journal of Materials Research 24(2): 379-385. |
en_US |
| dc.identifier.issn |
0884-2914 |
en_US |
| dc.identifier.uri |
http://nrs.harvard.edu/urn-3:HUL.InstRepos:4276342 |
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| dc.description.abstract |
In a previous paper, we have demonstrated that a microcrystalline copper film well bonded to a polymer substrate can be stretched beyond 50% without cracking. The film eventually fails through the co-evolution of necking and debonding from the substrate. Here we report much lower strains to failure (around 10%) for polymer-supported nanocrystalline metal films, whose microstructure is revealed to be unstable under mechanical loading. We find that strain localization and deformation-associated grain growth facilitate each other, resulting in an unstable deformation process. Film/substrate delamination can be found wherever strain localization occurs. We therefore propose that three concomitant mechanisms are responsible for the failure of a plastically deformable but microstructurally unstable thin metal film: strain localization at large grains, deformation-induced grain growth and film debonding from the substrate. |
en_US |
| dc.description.sponsorship |
Engineering and Applied Sciences |
en_US |
| dc.language.iso |
en_US |
en_US |
| dc.publisher |
Materials Research Society |
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| dc.relation.isversionof |
doi:10.1557/JMR.2009.0048 |
en_US |
| dc.relation.hasversion |
www.seas.harvard.edu/vlassak_group/publications/69_Failure2009.PDF |
en_US |
| dash.license |
OAP |
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| dc.subject |
cu films |
en_US |
| dc.subject |
grain growth |
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| dc.subject |
strain localization |
en_US |
| dc.subject |
debonding |
en_US |
| dc.subject |
Kapton |
en_US |
| dc.title |
Failure by Simultaneous Grain Growth, Strain Localization, and Interface Debonding in Metal Films on Polymer Substrates |
en_US |
| dc.type |
Journal Article |
en_US |
| dc.description.version |
Accepted Manuscript |
en_US |
| dc.relation.journal |
Journal of Materials Research |
en_US |
| dash.depositing.author |
Vlassak, Joost J.
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|
| dc.date.available |
2010-07-08T13:22:29Z |
|
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FAS Scholarly Articles [5171]
Peer reviewed scholarly articles from the Faculty of Arts and Sciences of Harvard University
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