This thesis explores mechanical behavior of microelectronic devices and lithium-ion batteries. We first examine electromigration-induced void formation in solder bumps by constructing a theory that couples electromigration and creep. The theory can predict the critical current density below which voids do not form. Due to the effects of creep, this quantity is found to be independent of the solder size and decrease exponentially with increasing temperature, different from existing theories.
