Surface Chemistry of Copper(I) Acetamidinates in Connection with Atomic Layer Deposition (ALD) Processes
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CitationMa, Qiang, Hansheng Guo, Roy G. Gordon, and Francisco Zaera. 2011. Surface chemistry of copper(I) acetamidinates in connection with atomic layer deposition (ALD) Processes. Chemistry of Materials 23(14): 3325-3334.
AbstractThe thermal chemistry of copper(I)-N,N′-di-sec-butylacetamidinate on Ni(110) single-crystal and cobalt polycrystalline surfaces was characterized under ultrahigh vacuum (UHV) conditions by X-ray photoelectron spectroscopy (XPS) and temperature-programmed desorption (TPD). A complex network of reactions were identified, starting with the dissociative adsorption of the precursor, from its dimeric form in its free state to a monomer once bonded to the nickel surface. The dissociation of a C–N bond in the acetamidinate ligand at 200K leads to the formation of adsorbed 2-butene and N-sec-butylacetamidinate. Some of the latter intermediates hydrogenate around 300K to release N-sec-butylacetamidine into the gas phase, while the remaining adsorbed species dissociate further around 400K, as the copper atoms become reduced to a metallic state, possibly to form acetonitrile and a sec-butylamido surface species that reacts further at 485 K to release 2-butene. By 800K, only copper and a small amount of carbon can be seen on the surface by XPS. The implications of this chemistry to the growth of metal films by atomic layer deposition (ALD) are discussed.
Citable link to this pagehttp://nrs.harvard.edu/urn-3:HUL.InstRepos:11169838
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