Hybrid stretchable circuits on silicone substrate
Lacour, S. P.
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CitationRobinson, A., A. Aziz, Q. Liu, Z. Suo, and S. P. Lacour. 2014. “Hybrid Stretchable Circuits on Silicone Substrate.” Journal of Applied Physics 115 (14) (April 14): 143511. doi:10.1063/1.4871279.
AbstractWhen rigid and stretchable components are integrated onto a single elastic carrier substrate, large strain heterogeneities appear in the vicinity of the deformable-non-deformable interfaces. In this paper, we report on a generic approach to manufacture hybrid stretchable circuits where commercial electronic components can be mounted on a stretchable circuit board. Similar to printed circuit board development, the components are electrically bonded on the elastic substrate and interconnected with stretchable electrical traces. The substrate—a silicone matrix carrying concentric rigid disks—ensures both the circuit elasticity and the mechanical integrity of the most fragile materials.
Citable link to this pagehttp://nrs.harvard.edu/urn-3:HUL.InstRepos:13363865
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