Browsing FAS Scholarly Articles by Keyword "dielectric science and materials"
Now showing items 1-2 of 2
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Chemical Vapor Deposition of Cobalt Nitride and its Application as an Adhesion-Enhancing Layer for Advanced Copper Interconnects
(Electrochemical Society, 2012)An interlayer of face centered cubic (fcc) Co4N has demonstrated significant improvements in adhesion between copper and diffusion barrier layers. This fcc phase of Co4N was prepared by chemical vapor deposition (CVD) using ... -
Smooth, Low-Resistance, Pinhole-free, Conformal Ruthenium Films by Pulsed Chemical Vapor Deposition
(Electrochemical Society, 2013)Ruthenium (Ru) thin films were deposited by pulsed chemical vapor deposition with precursors bis(N,N′-di-tert-butylacetamidinato)ruthenium(II)dicarbonyl, ammonia and hydrogen. Low-resistance polycrystalline Ru films with ...