High-temperature tensile behavior of freestanding Au thin films
Published Version
https://doi.org/10.1016/j.scriptamat.2013.11.011Metadata
Show full item recordCitation
Sim, Gi-Dong, and Joost J. Vlassak. 2014. “High-Temperature Tensile Behavior of Freestanding Au Thin Films.” Scripta Materialia 75 (March): 34–37. doi:10.1016/j.scriptamat.2013.11.011.Abstract
The mechanical behavior of freestanding thin sputter-deposited films of Au is studied at temperatures up to 340 °C, using tensile testing. Films tested at elevated temperatures exhibit a significant decrease in flow stress and stiffness. Furthermore, the flow stress decreases with decreasing film thickness, contravening the usual notion that “smaller is stronger”. This behavior is attributed mainly to diffusion-facilitated grain boundary sliding.Other Sources
http://imechanica.org/files/High%20temperature%20tensile%20behavior%20of%20free-standing%20Au%20thin%20films.pdfTerms of Use
This article is made available under the terms and conditions applicable to Open Access Policy Articles, as set forth at http://nrs.harvard.edu/urn-3:HUL.InstRepos:dash.current.terms-of-use#OAPCitable link to this page
http://nrs.harvard.edu/urn-3:HUL.InstRepos:22070871
Collections
- FAS Scholarly Articles [18292]
Contact administrator regarding this item (to report mistakes or request changes)