High-temperature tensile behavior of freestanding Au thin films

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High-temperature tensile behavior of freestanding Au thin films

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Title: High-temperature tensile behavior of freestanding Au thin films
Author: Sim, Gi-dong; Vlassak, Joost J.

Note: Order does not necessarily reflect citation order of authors.

Citation: Sim, Gi-Dong, and Joost J. Vlassak. 2014. “High-Temperature Tensile Behavior of Freestanding Au Thin Films.” Scripta Materialia 75 (March): 34–37. doi:10.1016/j.scriptamat.2013.11.011.
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Abstract: The mechanical behavior of freestanding thin sputter-deposited films of Au is studied at temperatures up to 340 °C, using tensile testing. Films tested at elevated temperatures exhibit a significant decrease in flow stress and stiffness. Furthermore, the flow stress decreases with decreasing film thickness, contravening the usual notion that “smaller is stronger”. This behavior is attributed mainly to diffusion-facilitated grain boundary sliding.
Published Version: doi:10.1016/j.scriptamat.2013.11.011
Other Sources: http://imechanica.org/files/High%20temperature%20tensile%20behavior%20of%20free-standing%20Au%20thin%20films.pdf
Terms of Use: This article is made available under the terms and conditions applicable to Open Access Policy Articles, as set forth at http://nrs.harvard.edu/urn-3:HUL.InstRepos:dash.current.terms-of-use#OAP
Citable link to this page: http://nrs.harvard.edu/urn-3:HUL.InstRepos:22070871
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