dc.contributor.author | Yang, Jing | |
dc.contributor.author | Feng, Jun | |
dc.contributor.author | Li, Kecheng | |
dc.contributor.author | Bhandari, Harish | |
dc.contributor.author | Li, Zhefeng | |
dc.contributor.author | Gordon, Roy Gerald | |
dc.date.accessioned | 2017-05-16T21:00:49Z | |
dc.date.issued | 2017 | |
dc.identifier | Quick submit: 2017-04-24T12:26:46-0400 | |
dc.identifier.citation | Yang, Jing, Jun Feng, Kecheng Li, Harish B. Bhandari, Zhefeng Li, and Roy G. Gordon. 2017. “Quantitative Evaluation of Cobalt Disilicide/Si Interfacial Roughness.” ECS Journal of Solid State Science and Technology 6 (5): P345–P349. doi:10.1149/2.0271705jss. | en_US |
dc.identifier.issn | 2162-8769 | en_US |
dc.identifier.uri | http://nrs.harvard.edu/urn-3:HUL.InstRepos:32696198 | |
dc.description.abstract | The formation of smooth, conformal cobalt disilicide (CoSi2) without facets or voids is critical for microelectronic device reliability owing to the ultra-shallow contact areas. Here we demonstrate the formation of smooth and conformal CoSi2 films by chemical vapor deposition (CVD) of cobalt nitride (CoxN) films on silicon (Si) or on silicon on insulator (SOI) substrates, followed by in-situ rapid thermal annealing (RTA) at 700°C. To reveal the CoSi2/Si interfacial morphology, we report a back-to-front sample preparation method, in which mechanical polishing, anisotropic tetramethylammonium hydroxide (TMAH) wet etching, hydrofluoric acid (HF) wet etching, and isotropic xenon difluoride (XeF2) dry etching are employed to remove the SOI substrate from the back side to expose the CoSi2/Si interface. This method offers a robust and reliable procedure for quantitative assessment of the CoSi2/Si interfacial roughness, as well as analytical support for advanced fabrication process development. | en_US |
dc.description.sponsorship | Chemistry and Chemical Biology | en_US |
dc.description.sponsorship | Engineering and Applied Sciences | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | The Electrochemical Society | en_US |
dc.relation.isversionof | 10.1149/2.0271705jss | en_US |
dash.license | OAP | |
dc.subject | Cobalt Silicide | en_US |
dc.subject | silicidation | en_US |
dc.subject | interface | en_US |
dc.subject | roughness measurement | en_US |
dc.title | Quantitative Evaluation of Cobalt Disilicide/Si Interfacial Roughness | en_US |
dc.type | Journal Article | en_US |
dc.date.updated | 2017-04-24T16:26:40Z | |
dc.description.version | Accepted Manuscript | en_US |
dc.relation.journal | ECS Journal of Solid State Science and Technology | en_US |
dash.depositing.author | Gordon, Roy Gerald | |
dc.date.available | 2017 | |
dc.date.available | 2017-05-16T21:00:49Z | |
dc.identifier.doi | 10.1149/2.0271705jss | * |
dash.authorsordered | false | |
dash.contributor.affiliated | Bhandari, Harish B | |
dash.contributor.affiliated | Yang, Jing | |
dash.contributor.affiliated | Li, Zhefeng | |
dash.contributor.affiliated | Li, Kecheng | |
dash.contributor.affiliated | Feng, Jun | |
dash.contributor.affiliated | Gordon, Roy | |