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Direct-liquid-evaporation chemical vapor deposition of smooth, highly conformal cobalt and cobalt nitride thin films

dc.contributor.authorYang, Jing
dc.contributor.authorLi, Kecheng
dc.contributor.authorFeng, Jun
dc.contributor.authorGordon, Roy Gerald
dc.date.accessioned2017-08-08T15:31:10Z
dc.date.issued2015
dc.identifierQuick submit: 2015-11-20T09:38:22-05:00
dc.identifier.citationYang, Jing, Kecheng Li, Jun Feng, and Roy G. Gordon. 2015. “Direct-Liquid-Evaporation Chemical Vapor Deposition of Smooth, Highly Conformal Cobalt and Cobalt Nitride Thin Films.” J. Mater. Chem. C 3 (46): 12098–12106. doi:10.1039/c5tc03221k.en_US
dc.identifier.issn2050-7526en_US
dc.identifier.urihttp://nrs.harvard.edu/urn-3:HUL.InstRepos:33724769
dc.description.sponsorshipChemistry and Chemical Biologyen_US
dc.language.isoen_USen_US
dc.publisherRoyal Society of Chemistry (RSC)en_US
dc.relation.isversionofdoi:10.1039/c5tc03221ken_US
dash.licenseMETA_ONLY
dc.titleDirect-liquid-evaporation chemical vapor deposition of smooth, highly conformal cobalt and cobalt nitride thin filmsen_US
dc.typeJournal Articleen_US
dc.date.updated2015-11-20T14:38:23Z
dc.description.versionVersion of Recorden_US
dc.rights.holderYang, Jing; Li, Kecheng; Feng, Jun; Gordon, Roy G.
dc.relation.journalJ. Mater. Chem. Cen_US
dash.depositing.authorGordon, Roy Gerald
dash.embargo.until10000-01-01
dc.identifier.doi10.1039/c5tc03221k*
dash.contributor.affiliatedYang, Jing
dash.contributor.affiliatedLi, Kecheng
dash.contributor.affiliatedFeng, Jun
dash.contributor.affiliatedGordon, Roy


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