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dc.contributor.authorSim, Gi-Dong
dc.contributor.authorPark, Jun-Hyub
dc.contributor.authorUchic, Michael D.
dc.contributor.authorShade, Paul A.
dc.contributor.authorLee, Soon-Bok
dc.contributor.authorVlassak, Joost J.
dc.date.accessioned2018-03-07T17:00:07Z
dc.date.issued2013
dc.identifierQuick submit: 2013-11-14T14:31:54-05:00
dc.identifier.citationSim, Gi-Dong, Jun-Hyub Park, Michael D. Uchic, Paul A. Shade, Soon-Bok Lee, and Joost J. Vlassak. 2013. An apparatus for performing microtensile tests at elevated temperatures inside a scanning electron microscope. Acta Materialia 61, no. 19: 7500-7510.en_US
dc.identifier.issn1359-6454en_US
dc.identifier.urihttp://nrs.harvard.edu/urn-3:HUL.InstRepos:34901219
dc.description.abstractIn this paper, we introduce an apparatus to perform microtensile tests at elevated temperatures inside a scanning electron microscope. The apparatus has a stroke of 250 μm with a displacement resolution of 10 nm and a load resolution of 9.7 μN. Measurements at elevated temperatures are performed through use of two silicon-based micromachined heaters that support the sample. Each heater consists of a tungsten heating element that also serves as a temperature gauge. To demonstrate the testing capabilities, tensile tests were performed on submicron Cu films at various temperatures up to 430 °C. Stress–strain curves show a significant decrease in yield strength and initial slope for the samples tested at elevated temperature, which we attribute to diffusion-facilitated grain boundary sliding and dislocation climb.en_US
dc.description.sponsorshipEngineering and Applied Sciencesen_US
dc.language.isoen_USen_US
dc.publisherElsevieren_US
dc.relation.isversionofdoi:10.1016/j.actamat.2013.08.064en_US
dash.licenseOAP
dc.subjectIn situ tension testen_US
dc.subjectHigh-temperature deformationen_US
dc.subjectThin filmen_US
dc.subjectGrain boundary slidingen_US
dc.subjectCreepen_US
dc.titleAn Apparatus for Performing Microtensile Tests at Elevated Temperatures inside a Scanning Electron Microscopeen_US
dc.typeJournal Articleen_US
dc.date.updated2013-11-14T19:33:04Z
dc.description.versionAccepted Manuscripten_US
dc.rights.holderG-D. Sim, J-H. Park, M.D. Uchic, P.A. Shade, S-B. Lee, J.J. Vlassak
dc.relation.journalActa Materialiaen_US
dash.depositing.authorVlassak, Joost J.
dc.date.available2018-03-07T17:00:07Z
dc.identifier.doi10.1016/j.actamat.2013.08.064*
workflow.legacycommentsVlassak emailed 2016-04-20 ADen_US
dash.contributor.affiliatedSim, Gi-dong
dash.contributor.affiliatedVlassak, Joost


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