Determining the Elastic Modulus and Hardness of an Ultrathin Film on a Substrate Using Nanoindentation
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Determining the Elastic Modulus and Hardness of an Ultrathin Film on a Substrate Using Nanoindentation
| Title: | Determining the Elastic Modulus and Hardness of an Ultrathin Film on a Substrate Using Nanoindentation |
| Author: |
Vlassak, Joost J.; Li, Han
Note: Order does not necessarily reflect citation order of authors. |
| Citation: | Li, Han, and Joost J. Vlassak. 2009. Determining the elastic modulus and hardness of an ultrathin film on a substrate using nanoindentation. Journal of Materials Research 24(3): 1114-1126. |
| Full Text & Related Files: |
Vlassak_ElasticHardnessFull.pdf (4.830Mb; PDF) 
Vlassak_FiguresTables_Elastic.pdf (4.278Mb; PDF)
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| Abstract: | A data analysis procedure has been developed to estimate the contact area in an elasto-plastic indentation of a thin film bonded to a substrate. The procedure can be used to derive the elastic modulus and hardness of the film from the indentation load, displacement, and contact stiffness data at indentation depths that are a significant fraction of the film thickness. The analysis is based on Yu’s elastic
solution for the contact of a rigid conical punch on a layered half-space and uses an approach similar to the Oliver-Pharr method for bulk materials. The methodology is demonstrated for both compliant films on stiff substrates and the reverse combination and shows improved accuracy over previous methods. |
| Published Version: | doi:10.1557/JMR.2009.0144 |
| Terms of Use: | This article is made available under the terms and conditions applicable to Open Access Policy Articles, as set forth at http://nrs.harvard.edu/urn-3:HUL.InstRepos:dash.current.terms-of-use#OAP |
| Citable link to this page: | http://nrs.harvard.edu/urn-3:HUL.InstRepos:4262334 |
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