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dc.contributor.authorLi, Han
dc.contributor.authorVlassak, Joost J.
dc.date.accessioned2010-06-24T13:46:10Z
dc.date.issued2009
dc.identifier.citationLi, Han, and Joost J. Vlassak. 2009. Determining the elastic modulus and hardness of an ultrathin film on a substrate using nanoindentation. Journal of Materials Research 24(3): 1114-1126.en_US
dc.identifier.issn0884-2914en_US
dc.identifier.urihttp://nrs.harvard.edu/urn-3:HUL.InstRepos:4262334
dc.description.abstractA data analysis procedure has been developed to estimate the contact area in an elasto-plastic indentation of a thin film bonded to a substrate. The procedure can be used to derive the elastic modulus and hardness of the film from the indentation load, displacement, and contact stiffness data at indentation depths that are a significant fraction of the film thickness. The analysis is based on Yu’s elastic solution for the contact of a rigid conical punch on a layered half-space and uses an approach similar to the Oliver-Pharr method for bulk materials. The methodology is demonstrated for both compliant films on stiff substrates and the reverse combination and shows improved accuracy over previous methods.en_US
dc.description.sponsorshipEngineering and Applied Sciencesen_US
dc.language.isoen_USen_US
dc.publisherMaterials Research Societyen_US
dc.relation.isversionofdoi:10.1557/JMR.2009.0144en_US
dash.licenseOAP
dc.subjectnanoindentationen_US
dc.subjectelastic propertiesen_US
dc.subjectsubstrate effecten_US
dc.subjectthin filmsen_US
dc.titleDetermining the Elastic Modulus and Hardness of an Ultrathin Film on a Substrate Using Nanoindentationen_US
dc.typeJournal Articleen_US
dc.description.versionAccepted Manuscripten_US
dc.relation.journalJournal of Materials Researchen_US
dash.depositing.authorVlassak, Joost J.
dc.date.available2010-06-24T13:46:10Z
dc.identifier.doi10.1557/JMR.2009.0144*
dash.contributor.affiliatedVlassak, Joost
dc.identifier.orcid0000-0002-2166-6288


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