Failure by Simultaneous Grain Growth, Strain Localization, and Interface Debonding in Metal Films on Polymer Substrates
Citation
Lu, Nanshu, Xi Wang, Zhigang Suo, and Joost Vlassak. 2009. Failure by simultaneous grain growth, strain localization, and interface debonding in metal films on polymer substrates. Journal of Materials Research 24(2): 379-385.Abstract
In a previous paper, we have demonstrated that a microcrystalline copper film well bonded to a polymer substrate can be stretched beyond 50% without cracking. The film eventually fails through the co-evolution of necking and debonding from the substrate. Here we report much lower strains to failure (around 10%) for polymer-supported nanocrystalline metal films, whose microstructure is revealed to be unstable under mechanical loading. We find that strain localization and deformation-associated grain growth facilitate each other, resulting in an unstable deformation process. Film/substrate delamination can be found wherever strain localization occurs. We therefore propose that three concomitant mechanisms are responsible for the failure of a plastically deformable but microstructurally unstable thin metal film: strain localization at large grains, deformation-induced grain growth and film debonding from the substrate.Other Sources
www.seas.harvard.edu/vlassak_group/publications/69_Failure2009.PDFTerms of Use
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http://nrs.harvard.edu/urn-3:HUL.InstRepos:4276342
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