Survey of Materials for Nanoskiving and Influence of the Cutting Process on the Nanostructures Produced

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Survey of Materials for Nanoskiving and Influence of the Cutting Process on the Nanostructures Produced

Show simple item record Lipomi, Darren J. Martinez, Ramses Valentin Rioux, Robert M. Cademartiri, Ludovico Reus, William F. Whitesides, George M. 2012-11-08T18:38:47Z 2010
dc.identifier.citation Lipomi, Darren J., Ramses V. Martinez, Robert M. Rioux, Ludovico Cademartiri, William F. Reus, and George M. Whitesides. 2010. Survey of materials for nanoskiving and influence of the cutting process on the nanostructures produced. ACS Applied Materials and Interfaces 2(9): 2503-2514. en_US
dc.identifier.issn 1944-8244 en_US
dc.identifier.issn 1944-8252 en_US
dc.description.abstract This paper examines the factors that influence the quality of nanostructures fabricated by sectioning thin films with an ultramicrotome (“nanoskiving”). It surveys different materials (metals, ceramics, semiconductors, and conjugated polymers), deposition techniques (evaporation, sputter deposition, electroless deposition, chemical-vapor deposition, solution-phase synthesis, and spin-coating), and geometries (nanowires or two-dimensional arrays of rings and crescents). It then correlates the extent of fragmentation of the nanostructures with the composition of the thin films, the methods used to deposit them, and the parameters used for sectioning. There are four major conclusions. (i) Films of soft and compliant metals (those that have bulk values of hardness less than or equal to those of palladium, or ≤500 MPa) tend to remain intact upon sectioning, whereas hard and stiff metals (those that have values of hardness greater than or equal to those of platinum, or ≥500 MPa) tend to fragment. (ii) All conjugated polymers tested form intact nanostructures. (iii) The extent of fragmentation is lowest when the direction of cutting is perpendicular to the exposed edge of the embedded film. (iv) The speed of cutting−from 0.1 to 8 mm/s−has no effect on the frequency of defects. Defects generated during sectioning include scoring from defects in the knife, delamination of the film from the matrix, and compression of the matrix. The materials tested were: aluminum, titanium, nickel, copper, palladium, silver, platinum, gold, lead, bismuth, germanium, silicon dioxide (\(\textrm{SiO}_2\)), alumina (\(\textrm{Al}_2\textrm{O}_3\)), tin-doped indium oxide (ITO), lead sulfide nanocrystals, the semiconducting polymers poly(2-methoxy-5-(2′-ethyl-hexyloxy)-1,4-phenylene vinylene) (MEH-PPV), poly(3-hexylthiophene) (P3HT), and poly(benzimidazobenzophenanthroline ladder) (BBL), and the conductive polymer poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS). en_US
dc.description.sponsorship Chemistry and Chemical Biology en_US
dc.language.iso en_US en_US
dc.publisher American Chemical Society en_US
dc.relation.isversionof doi:10.1021/am100434g en_US
dc.relation.hasversion en_US
dc.relation.hasversion en_US
dash.license OAP
dc.subject nanoskiving en_US
dc.subject nanofabrication en_US
dc.subject nanowires en_US
dc.subject microtome en_US
dc.subject ultramicrotomy en_US
dc.subject soft lithography en_US
dc.title Survey of Materials for Nanoskiving and Influence of the Cutting Process on the Nanostructures Produced en_US
dc.type Journal Article en_US
dc.description.version Accepted Manuscript en_US
dc.relation.journal ACS Applied Materials and Interfaces en_US Whitesides, George M. 2012-11-08T18:38:47Z

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