Sim, Gi-dongPark, Jun-HyubUchic, Michael D.Shade, Paul A.Lee, Soon-BokVlassak, Joost2018-03-072013Sim, Gi-Dong, Jun-Hyub Park, Michael D. Uchic, Paul A. Shade, Soon-Bok Lee, and Joost J. Vlassak. 2013. An apparatus for performing microtensile tests at elevated temperatures inside a scanning electron microscope. Acta Materialia 61, no. 19: 7500-7510.1359-6454http://nrs.harvard.edu/urn-3:HUL.InstRepos:34901219In this paper, we introduce an apparatus to perform microtensile tests at elevated temperatures inside a scanning electron microscope. The apparatus has a stroke of 250 μm with a displacement resolution of 10 nm and a load resolution of 9.7 μN. Measurements at elevated temperatures are performed through use of two silicon-based micromachined heaters that support the sample. Each heater consists of a tungsten heating element that also serves as a temperature gauge. To demonstrate the testing capabilities, tensile tests were performed on submicron Cu films at various temperatures up to 430 °C. Stress–strain curves show a significant decrease in yield strength and initial slope for the samples tested at elevated temperature, which we attribute to diffusion-facilitated grain boundary sliding and dislocation climb.en-USIn situ tension testHigh-temperature deformationThin filmGrain boundary slidingCreepJournal Article2013-11-14G-D. Sim, J-H. Park, M.D. Uchic, P.A. Shade, S-B. Lee, J.J. Vlassak2018-03-0710.1016/j.actamat.2013.08.064