Mahajan, AnkitHyun, Woo JinWalker, S. BrettLewis, JenniferFrancis, Lorraine F.Frisbie, C. Daniel2017-10-302015Mahajan, Ankit, Woo Jin Hyun, S. Brett Walker, Jennifer A. Lewis, Lorraine F. Francis, and C. Daniel Frisbie. 2015. “High-Resolution, High-Aspect Ratio Conductive Wires Embedded in Plastic Substrates.” ACS Applied Materials & Interfaces 7 (3) (January 28): 1841–1847. doi:10.1021/am507539a.1944-8244http://nrs.harvard.edu/urn-3:HUL.InstRepos:34309458A novel method is presented to fabricate high-resolution, high-aspect ratio metal wires embedded in a plastic substrate for flexible electronics applications. In a sequential process, high-resolution channels connected to low-resolution reservoirs are first created in a thermosetting polymer by imprint lithography. A reactive Ag ink is then inkjet-printed into the reservoirs and wicked into the channels by capillary forces. These features serve as a seed layer for copper deposition inside the channels via electroless plating. Highly conductive wires (>50% bulk metal) with minimum line width and spacing of 2 and 4 μm, respectively, and an aspect ratio of 0.6 are obtained. The embedded wires exhibit good mechanical flexibility, with minimal degradation in electrical performance after thousands of bending cycles.en-UShigh-resolution metal linesimprint lithographyinkjet printingcopper electroless platingflexible electronicsJournal Article2015-08-10Mahajan A, Hyun WJ, Walker SB, Lewis JA, Francis LF, and Frisbie CD10.1021/am507539a