Person: Kim, Wonyoung
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Kim
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Wonyoung
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Kim, Wonyoung
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Publication Voltage Smoothing: Characterizing and Mitigating Voltage Noise in Production Processors via Software-Guided Thread Scheduling(IEEE, 2010) Reddi, Vijay Janapa; Kanev, Svilen; Kim, Wonyoung; Campanoni, Simone; Smith, Michael; Wei, Gu-Yeon; Brooks, DavidParameter variations have become a dominant challenge in microprocessor design. Voltage variation is especially daunting because it happens so rapidly. We measure and characterize voltage variation in a running Intel Core2 Duo processor. By sensing on-die voltage as the processor runs single-threaded, multi-threaded, and multi-program workloads, we determine the average supply voltage swing of the processor to be only 4 percent, far from the processor's 14percent worst-case operating voltage margin. While such large margins guarantee correctness, they penalize performance and power efficiency. We investigate and quantify the benefits of designing a processor for typical-case (rather than worst-case) voltage swings, assuming that a fail-safe mechanism protects it from infrequently occurring large voltage fluctuations. With today's processors, such resilient designs could yield 15 percent to 20 percent performance improvements. But we also show that in future systems, these gains could be lost as increasing voltage swings intensify the frequency of fail-safe recoveries. After characterizing micro architectural activity that leads to voltage swings within multi-core systems, we show that a voltage-noise-aware thread scheduler in software can co-schedule phases of different programs to mitigate error recovery overheads in future resilient processor designs.Publication A fully integrated battery-connected switched-capacitor 4:1 voltage regulator with 70% peak efficiency using bottom-plate charge recycling(2016-02-24) Tong, Tao; Zhang, Xuan; Kim, Wonyoung; Brooks, David; Wei, Gu-YeonThis work presents a switched-capacitor (SC) DC-DC voltage regulator that converts a 3.7V battery voltage down to ~0.8V in order to power the `brain' SoC of a flapping-wing microrobotic bee. A cascade of two 2:1 SC converters offers high efficiency for a 4:1 conversion ratio. A charge recycling technique reduces the flying capacitor's bottom-plate parasitic loss by 50% and overall conversion efficiency reaches 70%. The output droop is less than 10% of the nominal output voltage for a worst-case 47mA load step.Publication A fully-integrated 3-level DC/DC converter for nanosecond-scale DVS with fast shunt regulation(IEEE, 2011) Kim, Wonyoung; Brooks, David; Wei, Gu-YeonIn recent years, chip multiprocessor architectures have emerged to scale performance while staying within tight power constraints. This trend motivates per core/block dynamic voltage and frequency scaling (DVFS) with fast voltage transition. Given the high cost and bulk of off-chip DC/DC converters to implement multiple on-chip power domains, there has been a surge of interest in on-chip converters. This paper presents the design and experimental results of a fully integrated 3-level DC/DC converter that merges characteristics of both inductor-based buck and switched-capacitor (SC) converters. While off-chip buck converters show high conversion efficiency, their on-chip counterparts suffer from loss due to low quality inductors. With the help of flying capacitors, the 3-level converter requires smaller inductors than the buck converter, reducing loss and on-die area overhead. Compared to SC converters that need more com plex structures to regulate higher than half the input voltage, 3-level converters can efficiently regulate the output voltage across a wide range of levels and load currents. Measured results from a 130nm CMOS test-chip prototype demon strate nanosecond-scale voltage transition times and peak conversion efficiency of 77%.Publication Voltage Noise in Production Processors(Institute of Electrical & Electronics Engineers (IEEE), 2011) Janapa Reddi, Vijay; Kanev, Svilen; Kim, Wonyoung; Campanoni, Simone; Smith, Michael; Wei, Gu-Yeon; Brooks, DavidVoltage variations are a major challenge in processor design. Here, researchers characterize the voltage noise characteristics of programs as they run to completion on a production Core 2 Duo processor. Furthermore, they characterize the implications of resilient architecture design for voltage variation in future systems.Publication Reducing Power Loss, Cost and Complexity of SoC Power Delivery Using Integrated 3-Level Voltage Regulators(2013-03-18) Kim, Wonyoung; Wei, Gu-Yeon; Brooks, David M.; Horowitz, Paul; Karnik, TanayTraditional methods of system-on-chip (SoC) power management based on dynamic voltage and frequency scaling (DVFS) is limited by 1) cores/IP blocks sharing a voltage domain provided by off-chip voltage regulators (VR) and 2) slow voltage scaling time \((<0.1V/\mu s)\). This global, slow DVFS cannot track the increasingly heterogeneous, fluctuating performance requirements of individual microprocessor cores and SoC components. Furthermore, traditional off-chip VRs add significant area overhead and component cost on the board. This thesis explores replacing a large portion of existing off-chip VRs with integrated voltage regulators (IVR) that can scale the voltage at a 50 mV/ns rate, which is 500 times faster than microsecond-scale voltage scaling with existing off-chip VRs. IVRs occupy 10 times smaller footprint than off-chip VRs, making it easy to duplicate them to provide per-core or per-IP-block voltage control. This thesis starts by summarizing the benefits of using IVRs to deliver power to SoCs. Based on a simulation study targeting a 1.6W, 4-core SoC, I show that greater than 20% energy savings is possible with fast, per-core DVFS enabled by IVRs. Next, I present two stand-alone IVR test-chips converting 1.8V and 2.4V to 0.4-1.4V while delivering maximum 1W to the output. Both test-chips incorporate a 3-level VR topology, which is suitable for integration because the topology allows for much smaller inductors (1nH) than existing inductor-based buck VRs. I also discuss reasons behind lower-than-simulated efficiencies in the test-chips and ways to improve. Finally, I conclude with future process technologies that can boost IVR conversion efficiencies and power densities.